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COMPANY Tong Hsing Electronic Industries, Ltd.

Tong Hsing COMPANY Introduction. The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar ...…

Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) Direct Plated Copper (DPC) substrate manufacturer since 1975. Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu ...…